Diffusil®-S is an opaque fused silica and manufactured exclusively from high-purity, synthetic raw materials in a Sol-Gel process. It meets the high purity requirements for use in the Semiconductor Industry.
It contains a higher number but significantly smaller gas bubbles of appr. 4 µm compared to other competitive materials. This results in improved thermal and optical properties of this material.
Its high reflectivity to infrared radiation makes it the ideal material for use in furnace processes in chip manufacture.
Thermal Properties
Thermal conductivity | |||||||
---|---|---|---|---|---|---|---|
Temperature in °C | 20 | 100 | 200 | 400 | 600 | 800 | 1,000 |
Thermal conductivity W / m*K | 1,29 | 1,32 | 1,37 | 1,43 | 1,47 | 1,56 | 1,68 |
Thermal conductivity | |||||||
---|---|---|---|---|---|---|---|
Temperature in °C | Thermal conductivity W / m*K | ||||||
20 | 1,29 | ||||||
100 | 1,32 | ||||||
200 | 1,37 | ||||||
400 | 1,43 | ||||||
600 | 1,47 | ||||||
800 | 1,56 | ||||||
1,000 | 1,68 |
Thermal expansion coefficient: | 5.6 x 10-7 • K-1 (20 °C – 900 °C) |
Softening Point: | 1,600 °C |
Max. working temperature - short term: | 1,200 °C |
Max. working temperature - long term: | 1,000 °C |
Thermal expansion coefficient: |
5.6 x 10-7 • K-1 (20 °C – 900 °C) |
Softening Point: |
1,600 °C |
Max. working temperature - short term: |
1,200 °C |
Max. working temperature - long term: |
1,000 °C |
Chemical Properties
Highly pure, synthetically produced starting materials guarantee a consistently high chemical purity of Diffusil®-S. The typical trace impurities of this material quality are shown below:
Trace impurities [ppm / weight] | |||||||||
---|---|---|---|---|---|---|---|---|---|
Al | Ca | Cu | Fe | K | Li | Mg | Na | Ti | Zr |
< 0,10 | < 0,50 | < 0,02 | < 0,30 | < 0,30 | < 0,05 | < 0,05 | < 0,50 | < 0,02 | < 0,02 |
Trace impurities [ppm / weight] | |||||||||
---|---|---|---|---|---|---|---|---|---|
Al | < 0,10 | ||||||||
Ca | < 0,50 | ||||||||
Cu | < 0,02 | ||||||||
Fe | < 0,30 | ||||||||
K | < 0,30 | ||||||||
Li | < 0,05 | ||||||||
Mg | < 0,05 | ||||||||
Na | < 0,50 | ||||||||
Ti | < 0,02 | ||||||||
Zr | < 0,02 |
OH-Content: | appr. 300 ppm / weight |
Acid resistancy: | acc. Class 1; DIN 12 116 |
Alkali resistancy: | acc. Class 1; DIN 52 332 |
OH-Content: |
appr. 300 ppm / weight |
Acid resistancy: |
acc. Class 1; Din 12 116 |
Alkali resistancy: |
acc. Class 1; DIN 52 322 |
Physical Properties
Density: | 2,11 g / cm3 |
Porosity: | < 4 % non-open Porosity |
Modulus of elasticity: | 50 - 54 kN / mm2 |
Bending strength (3-point): | 80 - 84 N / mm2 |
Density: |
2,11 g / cm³ |
Porosity: |
< 4%, non-open Porosity |
Modulus of elasticity: |
50 - 54 kN / mm² |
Bending strength (3-point): |
80 - 84 N / mm² |
Optical Properties
Extremely homogeneously distributed gas bubbles with a diameter of around 4 µm and a defined number of up to 2 billion / cm³ in the material lead to a uniformly high opacity of Diffusil®-S.
The quantity and size of the gas bubbles can be adapted to customer requirements. A higher concentration of gas bubbles further increases the optical reflectivity of the material.
Electrical Properties
Dielectric constant: | Electrical resistivity: |
---|---|
3,70 (20 °C · 106 Hz) | 1,0 x 1018 Ω • cm (20 °C) |
3,77 (23 °C 9 · 108 Hz) | 1,0 x 1010 Ω · cm (400 °C) |
3,81 (23 °C 3 · 1010 Hz) | 6,3 x 106 Ω · cm (800 °C) |
Dielectric constant: | Electrical resistivity: |
---|---|
3,70 (20 °C · 106 Hz) | 1,0 x 1018 Ω • cm (20 °C) |
3,77 (23 °C · 108 Hz) | 1,0 x 1010 Ω • cm (400 °C) |
3,81 (23 °C · 1010 Hz) | 6,3 x 106 Ω • cm (800 °C) |
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